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Wednesday, September 27, 2023
Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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Circuit Design Desktop Processors Interconnects Packaging Server Processors Subscriber Only Content 

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor 3D V-Cache, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, subscriber only (general), System on Integrated Chips (SoIC)

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

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Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

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Architectures Neural Processors Subscriber Only Content 

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor Intel, subscriber only (general)

[Subscription] A look at the neural processor inside every Intel processor.

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Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

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Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries Process Technologies Subscriber Only Content 

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Architectures Neural Processors Packaging Subscriber Only Content 

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor neural processors, Preferred Networks, subscriber only (general), Supercomputers

[Subscriber Content] Inside Preferred Networks’ AI processor and the world’s most power-efficient supercomputer it powers.

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Architectures Data Processing Unit Subscriber Only Content 

YouTube Accelerates Transcoding

August 21, 2021August 21, 2021 David Schor accelerator, ASPLOS 2021, google, H.264, subscriber only (general), video acceleration, Video Coding Unit (VCU), VP9, YouTube

Google accelerates YouTube and other video services with custom silicon.

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Silicon Photonics Subscriber Only Content VLSI 2021 

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, silicon photonics, subscriber only (general), TeraPHY, VLSI 2021

[Subscriber Content] Ayar Labs photonics chiplet inches towards production readiness

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  • ← Previous

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

December 21, 2017May 25, 2021 David Schor
Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

February 20, 2022February 21, 2022 David Schor
TSMC N3, And Challenges Ahead

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor
ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

March 17, 2018May 25, 2021 David Schor
Samsung 5 nm and 4 nm Update

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor
AMD Announces Threadripper 2, Chiplets Aid Core Scaling

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

August 7, 2018May 25, 2021 David Schor
Hot Chips 30: Nvidia Xavier SoC

Hot Chips 30: Nvidia Xavier SoC

September 8, 2018May 25, 2021 David Schor
Arm Highlights Near-Term Roadmap

Arm Highlights Near-Term Roadmap

April 4, 2021May 23, 2021 David Schor
Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor
VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

July 22, 2018May 25, 2021 David Schor
A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

January 12, 2020May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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