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Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
TSMC N3, And Challenges Ahead
Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor

Subscriber-Only ContentView All

Our latest subscriber-only content. Our patrons enjoy early-bird access to some of our content.

A Look At AMD’s 3D-Stacked V-Cache
Circuit Design Desktop Processors Interconnects Packaging Server Processors Subscriber Only Content 

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

TSMC Demos SoIC_H for High-Bandwidth HPC Applications
Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
The NPU Inside Every Intel PC
Architectures Neural Processors Subscriber Only Content 

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor
Samsung Foundry On EUV, Pellicles, Capacity, and Yield
Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor

ArchitecturesView All

Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

Arm Introduces Its Newest Flagship Performance Core, The Cortex-X4

Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor

Arm Introduces A New Big Core, The Cortex-A720

Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor

Arm Launches The Cortex-A520, Next-Gen Efficiency Little Core

Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process
Architectures Foundries 

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor

Intel, SiFive demonstrated high-performance RISC-V Horse Creek development platform on Intel 4 Process.

Process TechnologyView All

Our latest coverage from the semiconductor world including recent announcements and analysis of new process nodes from semiconductor foundries including Intel, TSMC, Samsung, GlobalFoundries, and other.

TSMC N3, And Challenges Ahead
Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor

A Look At TSMC N3 Process

N3E Replaces N3; Comes In Many Flavors
Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor
A Look At Intel 4 Process Technology
Foundries Process Technologies VLSI 2022 

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor

SupercomputersView All

The latest chip-related news from the world of HPC and supercomputers.

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
Architectures Hot Interconnects 26 Interconnects Supercomputers 

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip
Architectures Neural Processors Supercomputers Supercomputing 19 

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio
Architectures Roadmaps Server Processors Supercomputers Supercomputing 19 

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

Cavium Takes ARM to Petascale with Astra
Supercomputers 

Cavium Takes ARM to Petascale with Astra

Fujitsu Completes Post-K ARM CPU Prototype
Supercomputers 

Fujitsu Completes Post-K ARM CPU Prototype

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest
Supercomputers 

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer
Server Processors Supercomputers 

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges
Supercomputers 

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

ConferencesView All

  • TSMC N3, And Challenges Ahead
    Foundries IEDM 2022 Interconnects Process Technologies 

    TSMC N3, And Challenges Ahead

  • IEDM 2022: Did We Just Witness The Death Of SRAM?
    Foundries IEDM 2022 

    IEDM 2022: Did We Just Witness The Death Of SRAM?

  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
    AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors 

    SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

  • A Look At Samsung’s 4LPE Process
    Foundries IEDM 2021 Process Technologies Subscriber Only Content 

    A Look At Samsung’s 4LPE Process

  • A Look At Intel 4 Process Technology
    Foundries Process Technologies VLSI 2022 

    A Look At Intel 4 Process Technology

TSMC N3, And Challenges AheadTSMC N3, And Challenges AheadIEDM 2022: Did We Just Witness The Death Of SRAM?IEDM 2022: Did We Just Witness The Death Of SRAM?SiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsSiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsA Look At Samsung’s 4LPE ProcessA Look At Samsung’s 4LPE ProcessA Look At Intel 4 Process TechnologyA Look At Intel 4 Process Technology

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • Arm Introduces A New Big Core, The Cortex-A720
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

December 23, 2018May 25, 2021 David Schor
Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen

Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen

May 3, 2019May 25, 2021 David Schor
Intel Silently Launches Cannon Lake

Intel Silently Launches Cannon Lake

May 15, 2018May 25, 2021 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
Ayar Labs Realizes Co-Packaged Silicon Photonics

Ayar Labs Realizes Co-Packaged Silicon Photonics

January 19, 2020May 25, 2021 David Schor

Random Tags

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x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

ISSCC 2018: The IBM z14 Microprocessor And System Control Design

ISSCC 2018: The IBM z14 Microprocessor And System Control Design

May 13, 2018May 25, 2021 David Schor
VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor
ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

January 3, 2019May 25, 2021 David Schor
POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019

POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019

October 7, 2018May 25, 2021 David Schor
Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

November 11, 2018May 25, 2021 David Schor
Intel Launches 10th Gen Comet Lake vPro Processors

Intel Launches 10th Gen Comet Lake vPro Processors

May 13, 2020May 23, 2021 David Schor
IBM Introduces Next-Gen Z  Mainframe: The z15; Wider Cores, More Cores, More Cache, Still 5.2 GHz

IBM Introduces Next-Gen Z Mainframe: The z15; Wider Cores, More Cores, More Cache, Still 5.2 GHz

September 14, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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