AMD 3D Stacks SRAM Bumplessly

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.

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The Mesh Network For Next-Generation Neoverse Chips

Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators, chiplets, and processors.

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Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

Arm launches its next-generation server CPUs – Neoverse N2 and Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores bring 1.4-1.5x higher IPC , SVE support, BFloat16, and the ARMv9 architecture.

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