Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA
With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
Read moreWith Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
Read moreAMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
Read moreArm is introducing a new cache-coherent and SoC-level interconnects, the CoreLink CI-700 & NI-700.
Read moreArm introduces its new DynamIQ Share Unit 110 for new Armv9 CPUs
Read moreArm launches the Cortex-X2, second-generation Cortex-X, and their new flagship performance Armv9 big core.
Read moreArm introduces their new Armv9 little core, the Cortex-A510 with significant PPA improvements.
Read moreArm unveils their newest Armv9 big core, the Cortex-A710.
Read moreArm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators, chiplets, and processors.
Read moreThe IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.
Read moreArm launches its next-generation server CPUs – Neoverse N2 and Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores bring 1.4-1.5x higher IPC , SVE support, BFloat16, and the ARMv9 architecture.
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