Architectures

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor Alder Lake, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel details Golden Cove, the company’s next-generation big core for client and server SoCs

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021August 2, 2021 David Schor 7 nm, Esperanto, ET-Maxion, ET-Minion, ET-SoC-1, neural processors, RISC-V, TSMC

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

Architectures

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor ARM, ARMv9, ARMv9.2, Confidential Compute Architecture (CCA), confidential computing, Dynamic TrustZone, Realm Management Extension (RME), secure enclave, TrustZone

Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.

Architectures FPGAs Subscriber Only Content

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor 16 nm, Diamond Mesa, eASIC Nextreme, Intel, Intel eASIC, Structured ASIC, subscriber only (general)

With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.

Architectures Desktop Processors Interconnects Packaging

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor 3D packaging, 3D V-Cache, 7 nm, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, SRAM, System on Integrated Chips (SoIC)

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.