TSMC N3, And Challenges Ahead
A Look At TSMC N3 Process
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Interconnects
A Look At AMD’s 3D-Stacked V-Cache
[Subscription] A technical look at AMD’s 3D-Stacked V-Cache
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SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
SiFive introduces a new high-performance coprocessor interface targeting custom accelerators; scores design wins from Google, NASA.
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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
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AMD 3D Stacks SRAM Bumplessly
AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
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Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Arm is introducing a new cache-coherent and SoC-level interconnects, the CoreLink CI-700 & NI-700.
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Arm Launches The DSU-110 For New Armv9 CPU Clusters
Arm introduces its new DynamIQ Share Unit 110 for new Armv9 CPUs
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The Mesh Network For Next-Generation Neoverse Chips
Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators, chiplets, and processors.
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics
Ranovus launches its Odin platform, a multi-wavelength Quantum Dot Laser (QDL) based silicon photonic engine which includes 800Gbps to 3.2Tbps single-chip engines as well as co-packaged optics scaling up to 51.2Tbps for next-generation data center switches and other HPC compute chips that require high bandwidth capacity.
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