Ayar Labs Realizes Co-Packaged Silicon Photonics

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

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OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates

A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposers and bridges.

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GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

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Nvidia Inference Research Chip Scales to Dozens of Chiplets

Nvidia recently presented a research chip comprising dozens of chiplets that enables them to scale from milliwatts to hundreds of watts in order to cater to different markets such as edge, mobile, automotive, and data center.

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