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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Author: David Schor

Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor Advanced Matrix Extension (AMX), AVX-512, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel unveiled Sapphire Rapids, its next-generation server CPUs

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Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor Alder Lake, Gracemont, Intel, Intel 7, Tremont, x86

Intel’s Gracemont small core eclipses last-generation Skylake big core performance and energy efficiency

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Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor Alder Lake, DDR5, Golden Cove, Gracemont, Intel, Intel 7, LPDDR5x, PCIe 5.0, x86

Intel unveiled Alder Lake, the company’s next-generation mainstream heterogeneous multi-core SoC for mobile through desktop

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Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor Alder Lake, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel details Golden Cove, the company’s next-generation big core for client and server SoCs

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Silicon Photonics Subscriber Only Content VLSI 2021 

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, silicon photonics, subscriber only (general), TeraPHY, VLSI 2021

[Subscriber Content] Ayar Labs photonics chiplet inches towards production readiness

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Packaging Subscriber Only Content 

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.

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Packaging Roadmaps 

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

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Foundries Process Technologies Roadmaps 

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

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Foundries Process Technologies Roadmaps 

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

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Neural Processors Subscriber Only Content 

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor 14 nm, 14LPP, 2.5D packaging, Baidu, HBM, Kunlun, neural processors, subscriber only (general)

A peek inside Baidu’s in-house neural processor

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Top Six Articles

  • TSMC N3, And Challenges Ahead
  • A Look At Intel 4 Process Technology
  • TSMC Details 5 nm
  • Arm Cortex-X1: The First From The Cortex-X Custom Program
  • VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor

IBM Open Sources Power ISA, Delays POWER10 to 2021

September 12, 2019May 25, 2021 David Schor
7nm Boosted Zen 2 Capabilities but Doubled the Challenges

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor
Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor
Centaur New x86 Server Processor Packs an AI Punch

Centaur New x86 Server Processor Packs an AI Punch

January 24, 2020May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Hot Chips 30: Intel Kaby Lake G

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor
A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor
Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

December 9, 2019May 25, 2021 David Schor
Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

July 13, 2018May 25, 2021 David Schor
TSMC Demos SoIC_H for High-Bandwidth HPC Applications

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

April 16, 2019May 25, 2021 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson

ARM WorldView All

Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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