TSMC 2021 Foundry Update: Foundry Roadmap
TSMC 2021 foundry update
Read moreTSMC 2021 foundry update
Read moreMarvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces
Read moreArm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.
Read moreIntel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
Read moreWith Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
Read moreWith hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
Read moreAMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
Read moreArm is introducing a new cache-coherent and SoC-level interconnects, the CoreLink CI-700 & NI-700.
Read moreArm introduces its new DynamIQ Share Unit 110 for new Armv9 CPUs
Read moreArm launches the Cortex-X2, second-generation Cortex-X, and their new flagship performance Armv9 big core.
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