A Look At AMD’s 3D-Stacked V-Cache
[Subscription] A technical look at AMD’s 3D-Stacked V-Cache
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Packaging
TSMC Demos SoIC_H for High-Bandwidth HPC Applications
[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.
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Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer
[Subscriber Content] Inside Preferred Networks’ AI processor and the world’s most power-efficient supercomputer it powers.
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5th Gen CoWoS-S Extends 3 Reticle Size
TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.
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Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding
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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
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AMD 3D Stacks SRAM Bumplessly
AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
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The Magnets Under the Icy Lake
The magnets under the icy lake
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics
Ranovus launches its Odin platform, a multi-wavelength Quantum Dot Laser (QDL) based silicon photonic engine which includes 800Gbps to 3.2Tbps single-chip engines as well as co-packaged optics scaling up to 51.2Tbps for next-generation data center switches and other HPC compute chips that require high bandwidth capacity.
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