Your Chips and Semi News
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the prior generation.
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Arm updates its Neoverse roadmap with the Neoverse N2 and V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X series, the Neoverse V-series will ease its power and area constraints in favor of higher performance.
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IBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32.
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CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
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Intel refreshes its second-generation Xeon Scalable lineup mid-cycle with new mainstream dual-socket CPUs, improving the performance-per-dollar by as much as 2x over original SKUs.
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A look at Centaur’s new server-class x86 SoC with an integrated neural processor.
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Zhaoxin unveiled plans for two new x86 SoC designs: a high-performance 16-nanometer server chip with up to 32 cores and a separate 7 nm mobile and desktop chip.
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Centaur lifts the veil on CNS, its next-generation x86 core for data center and edge computing. The core improving performance in many areas and adds support for the AVX-512 extension.
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NEC refreshes its SX-Aurora Vector Engine accelerator cards, adopts AMD processors, and outlines roadmap.
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Intel unveils the node architecture of the Aurora Supercomputer; the system will feature Intel’s first Xe GPGPU for HPC, 7nm Ponte Vecchio.
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