Intel Launches 12th Gen Core Desktop Alder Lake Processors
Intel launches 12th Gen Core desktop processors based on the Alder Lake microarchitecture.
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10 nm
Intel Talks 10nm DTCO, EUV Benefits
Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
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The Magnets Under the Icy Lake
The magnets under the icy lake
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Q1 2021 Foundry Update: Spending Bonanza
A look at the current state of leading-edge foundries for the first quarter of 2021.
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Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips
In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.
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Intel Launches Lakefield: An Experiment With Multiple New Technologies
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC
A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029
Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.
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SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio
Intel unveils the node architecture of the Aurora Supercomputer; the system will feature Intel’s first Xe GPGPU for HPC, 7nm Ponte Vecchio.
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VLSI 2018: Samsung’s 11nm nodelet, 11LPP
A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.
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