Samsung Foundry On EUV, Pellicles, Capacity, and Yield
Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.
Read moreSamsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.
Read moreA look at Intel’s next-generation high-performance process technology, Intel 4.
Read moreTSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.
Read moreAlibaba open-source its high-performance XuanTie RISC-V Cores; introduces a new in-house Armv9 server chip
Read moreA TSMC 2021 foundry update: automotive, networking, and HPC roadmap.
Read moreTSMC 2021 foundry update
Read moreMarvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces
Read moreIntel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
Read moreSamsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.
Read moreA look at the current state of leading-edge foundries for the first quarter of 2021.
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