Your Chips and Semi News
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the prior generation.
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Intel publishes details of its upcoming Advanced Matrix Extension (AMX), an x86 extension set to debut with Sapphire Rapids that introduces a new matrix register file and accompanying matrix operations.
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Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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Intel launches its 10th-generation Comet Lake-based vPro processors.
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Intel launches a new series of Xeon W processors for entry-level workstations based on Comet Lake.
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Intel launches 10th Generation Core desktop processors, formerly codename Comet Lake. The new lineup brings 22 new chips with up to 10 cores and 20 threads with turbo frequencies of up to 5.3 GHz.
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A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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Intel refreshes its second-generation Xeon Scalable lineup mid-cycle with new mainstream dual-socket CPUs, improving the performance-per-dollar by as much as 2x over original SKUs.
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Intel axes Nervana in favor of Habana.
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