CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor
CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreCEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreUMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.
Read morePresented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.
Read moreZhaoxin has launched the highest-performance domestic Chinese x86 chips based on the WuDaoKou microarchitecture. Zhaoxin new chips are a brand new SoC design featuring higher performance cores, a new DDR4 memory controller and integrated graphics.
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