Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Arm is introducing a new cache-coherent and SoC-level interconnects, the CoreLink CI-700 & NI-700.
Read moreArm is introducing a new cache-coherent and SoC-level interconnects, the CoreLink CI-700 & NI-700.
Read moreArm introduces its new DynamIQ Share Unit 110 for new Armv9 CPUs
Read moreArm launches the Cortex-X2, second-generation Cortex-X, and their new flagship performance Armv9 big core.
Read moreArm introduces their new Armv9 little core, the Cortex-A510 with significant PPA improvements.
Read moreArm unveils their newest Armv9 big core, the Cortex-A710.
Read moreThe magnets under the icy lake
Read moreArm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators, chiplets, and processors.
Read moreSamsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.
Read moreA look at the current state of leading-edge foundries for the first quarter of 2021.
Read moreThe IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.
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