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  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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CoWoS

Packaging Subscriber Only Content 

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.

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Interconnects Packaging Process Technologies 

TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

March 3, 2020May 25, 2021 David Schor 2.5D packaging, 5 nm, 7 nm, CoWoS, interposer

TSMC announces an enhancement to its CoWoS packaging technology with support for up to 2x the reticle size. The new technology is ready for next-generation 5-nanometer HPC applications.

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IEDM 2019 Interconnects Packaging Process Technologies 

TSMC Digs Trenches In Search Of Higher Performance

December 14, 2019May 25, 2021 David Schor 2.5D packaging, CoWoS, DTC, IEDM, IEDM 2019, MiM, TSMC

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.

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Packaging Process Technologies SEMICON West 2019 VLSI 2019 

TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

July 28, 2019May 25, 2021 David Schor 3D packaging, 3nm, 5nm, 6nm, 7nm, CoWoS, InFO, InFO_AiP, InFO_MS, InFO_oS, N5, N5P, N6, N7, N7P, SemiConWest, SoIC, TSMC, VLSI 2019, VLSI Symposium

An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.

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Interconnects Packaging Server Processors VLSI 2019 

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

June 22, 2019May 25, 2021 David Schor 7nm, ARM, ARMv8, chiplet, Cortex-A72, CoWoS, LIPINCON, TSMC, VLSI 2019, VLSI Symposium

A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.

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Top Six Articles

  • TOP500 50th List Anniversary: A Visualized Breakdown
  • TSMC Details 5 nm
  • TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
  • IEDM 2017: AMD’s grand vision for the future of HPC
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • TSMC 5-Nanometer Update

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor
Cavium Takes ARM to Petascale with Astra

Cavium Takes ARM to Petascale with Astra

August 25, 2018May 25, 2021 David Schor
IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

January 6, 2019May 25, 2021 David Schor
AMD 3D Stacks SRAM Bumplessly

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor
Photonics Chiplet Inches Towards Production

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel axes Knights Hill, plans a new microarchitecture for exascale

Intel axes Knights Hill, plans a new microarchitecture for exascale

November 14, 2017May 25, 2021 David Schor
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor
Intel Sunny Cove Core To Deliver A Major Improvement In Single-Thread Performance, Bigger Improvements To Follow

Intel Sunny Cove Core To Deliver A Major Improvement In Single-Thread Performance, Bigger Improvements To Follow

May 28, 2019May 25, 2021 David Schor
Marvell Lays Out ARM Server Roadmap

Marvell Lays Out ARM Server Roadmap

November 9, 2019May 25, 2021 David Schor
SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

September 20, 2022September 20, 2022 David Schor
Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

November 8, 2017May 25, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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