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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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VLSI 2019

Architectures Circuit Design Manycore Processors Network-on-Chip Neural Processors VLSI 2019 

A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

January 12, 2020May 25, 2021 David Schor 16nm, AI, Celerity, DARPA, DARPA CRAFT, inference, Network-on-Chip (NoC), neural processors, PLL, RISC-V, VLSI, VLSI 2019

A look at the 496-core RISC-V manycore array, network-on-chip, and the digital PLL of the Celerity open-source RISC-V tiered accelerator.

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Process Technologies VLSI 2019 

Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

October 18, 2019May 25, 2021 David Schor 22 nm, 22FFL, Intel, Intel Custom Foundry, MRAM, non-volatile memory, ReRAM, RRAM, VLSI 2019, VLSI Symposium

Intel expands its 22FFL process with new production-ready MRAM and RRAM technologies.

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Packaging Process Technologies SEMICON West 2019 VLSI 2019 

TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

July 28, 2019May 25, 2021 David Schor 3D packaging, 3nm, 5nm, 6nm, 7nm, CoWoS, InFO, InFO_AiP, InFO_MS, InFO_oS, N5, N5P, N6, N7, N7P, SemiConWest, SoIC, TSMC, VLSI 2019, VLSI Symposium

An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.

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Interconnects Packaging Server Processors VLSI 2019 

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

June 22, 2019May 25, 2021 David Schor 7nm, ARM, ARMv8, chiplet, Cortex-A72, CoWoS, LIPINCON, TSMC, VLSI 2019, VLSI Symposium

A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.

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Process Technologies VLSI 2019 

TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO

June 16, 2019May 25, 2021 David Schor 7HPC, 7nm, FinFET, SDM845, SDM855, Snapdragon 800, Snapdragon 855, TSMC, VLSI 2019, VLSI Symposium

Update and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.

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Top Six Articles

  • Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • TSMC N3, And Challenges Ahead
  • Ampere Ships First Gen ARM Server Processors
  • A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip
  • Arm Introduces A New Big Core, The Cortex-A720

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

February 3, 2018May 25, 2021 David Schor
Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and  112G Transceivers

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor
TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

March 3, 2020May 25, 2021 David Schor
The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

June 29, 2020May 23, 2021 David Schor
A Look At Samsung’s 4LPE Process

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Inside Baidu’s In-House Neural Processor

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor
The RISC-V momentum continues with the GAP8, a new IoT/AI Application Processor

The RISC-V momentum continues with the GAP8, a new IoT/AI Application Processor

February 28, 2018May 25, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor
Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor
Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Groq Tensor Streaming Processor Delivers 1 PetaOPS of Compute

Groq Tensor Streaming Processor Delivers 1 PetaOPS of Compute

November 15, 2019May 25, 2021 David Schor
A Look At AMD’s 3D-Stacked V-Cache

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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