IBM Adds POWER9 AIO, Pushes for an Open Memory-Agnostic Interface
IBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.
Read moreIBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.
Read moreIntel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.
Read moreFirst detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
Read moreA look at the IPU architecture of analog AI startup Mythic which attempts to significantly reduce the power consumption by computing directly in analog in flash.
Read moreAlibaba launches its own homegrown inference accelerator for their own cloud.
Read moreA deep dive into the custom-designed Tesla neural processing units integrated inside the company’s full self-driving (FSD) chip based on the Tesla Hot Chips 31 talk.
Read moreGlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.
Read moreIBM introduces its latest Z mainframe, the z15. Here’s a detailed look at the changes and enhancements that were made including the new system architecture and CPU microarchitecture.
Read moreAt the recent OpenPOWER Summit, IBM outlined their new roadmap, open-sourced the Power ISA, and made a number of additional announcements.
Read moreAt look the Ice Lake Thunderbolt 3 integration, Intel’s biggest integration since the graphics on Sandy Bridge.
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