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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Circuit Design Desktop Processors Interconnects Packaging Server Processors Subscriber Only Content 

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor 3D V-Cache, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, subscriber only (general), System on Integrated Chips (SoIC)

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

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Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

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Architectures Neural Processors Subscriber Only Content 

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor Intel, subscriber only (general)

[Subscription] A look at the neural processor inside every Intel processor.

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Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

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Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries Process Technologies Subscriber Only Content 

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Architectures Neural Processors Packaging Subscriber Only Content 

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor neural processors, Preferred Networks, subscriber only (general), Supercomputers

[Subscriber Content] Inside Preferred Networks’ AI processor and the world’s most power-efficient supercomputer it powers.

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Architectures Data Processing Unit Subscriber Only Content 

YouTube Accelerates Transcoding

August 21, 2021August 21, 2021 David Schor accelerator, ASPLOS 2021, google, H.264, subscriber only (general), video acceleration, Video Coding Unit (VCU), VP9, YouTube

Google accelerates YouTube and other video services with custom silicon.

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Silicon Photonics Subscriber Only Content VLSI 2021 

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, silicon photonics, subscriber only (general), TeraPHY, VLSI 2021

[Subscriber Content] Ayar Labs photonics chiplet inches towards production readiness

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  • ← Previous

Top Six Articles

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • TSMC N3, And Challenges Ahead
  • A Look At Intel 4 Process Technology
  • TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
  • VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

May 11, 2019May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor
TSMC 2021 Foundry Update: Foundry Roadmap

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor
Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and  112G Transceivers

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor
AMD introduces Ryzen 2nd Gen up for pre-order

AMD introduces Ryzen 2nd Gen up for pre-order

April 13, 2018May 25, 2021 David Schor
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor
The 2,048-core PEZY-SC2 sets a Green500 record

The 2,048-core PEZY-SC2 sets a Green500 record

November 1, 2017May 25, 2021 David Schor
Marvell Lays Out ARM Server Roadmap

Marvell Lays Out ARM Server Roadmap

November 9, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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