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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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7 nm

Foundries 

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

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Mobile Processors 

AMD Launches Ryzen Pro 4000 Series

May 7, 2020May 23, 2021 David Schor 7 nm, AMD, Ryzen, Ryzen Pro, Zen 2

AMD launches its Zen 2-based Ryzen Pro 4000 series for enterprise customers.

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Foundries IEDM 2019 ISSCC 2020 Process Technologies 

TSMC Details 5 nm

March 21, 2020May 25, 2021 David Schor 5 nm, 7 nm, EUV, N5, N5P, TSMC

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

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Interconnects Packaging Process Technologies 

TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

March 3, 2020May 25, 2021 David Schor 2.5D packaging, 5 nm, 7 nm, CoWoS, interposer

TSMC announces an enhancement to its CoWoS packaging technology with support for up to 2x the reticle size. The new technology is ready for next-generation 5-nanometer HPC applications.

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Architectures Circuit Design Graphics Processors ISSCC 2020 

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor 7 nm, AMD, ISSCC, ISSCC 2020, N7P, Navi, Radeon, Radeon RX 5700

A look at AMD’s Radeon RX 5700 GPU built on a 7-nanometer process based on the new Navi microarchitecture and RDNA graphics architecture.

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Architectures Floorplanning Interconnects ISSCC 2020 

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor 14 nm, 7 nm, AMD, capacitance, GlobalFoundries, ISSCC, ISSCC 2020, resistance, TSMC, wire delay, Zen, Zen 2

The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.

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IEDM 2019 Process Technologies Roadmaps 

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor 1.4 nm, 10 nm, 10nm, 2 nm, 3 nm, 5 nm, 7 nm, Intel

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

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Architectures Mobile Processors 

Samsung M5 Core Details Show Up

November 21, 2019May 25, 2021 David Schor 7 nm, 7LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the high-level changes to the Exynos M5 core found in the Exynos 990.

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Architectures Roadmaps Server Processors Supercomputers Supercomputing 19 

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

November 17, 2019May 25, 2021 David Schor 10 nm, 7 nm, Aurora, Intel, Sapphire Rapids, Supercomputer, Supercomputers, x86, Xe

Intel unveils the node architecture of the Aurora Supercomputer; the system will feature Intel’s first Xe GPGPU for HPC, 7nm Ponte Vecchio.

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Roadmaps Server Processors 

Marvell Lays Out ARM Server Roadmap

November 9, 2019May 25, 2021 David Schor 16nm, 7 nm, ARM, Linley Processor Conference, Marvell, Scalable Vector Extension (SVE), ThunderX, ThunderX2, ThunderX3, ThunderX4

Marvell outlines its current and future Arm server microprocessor roadmap, aiming at a 2-year cadence with greater than 2x performance gen-over-gen.

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Top Six Articles

  • Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32
  • A Look At Intel 4 Process Technology
  • AMD Announces 3rd Gen Ryzen Threadripper
  • Arm Introduces Its Confidential Compute Architecture

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Arm Launches Next-Gen Efficiency Core; Cortex-A520

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
AMD Discloses Initial Zen 2 Details

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor
The NPU Inside Every Intel PC

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor
VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor
A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021August 2, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

PEZY dominates the new Green500 list

PEZY dominates the new Green500 list

November 13, 2017May 25, 2021 David Schor
Intel launches 8th Gen Core with Radeon RX Vega Graphics

Intel launches 8th Gen Core with Radeon RX Vega Graphics

January 7, 2018May 25, 2021 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson
Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

July 24, 2018May 25, 2021 David Schor
Arm Launches ARMv9

Arm Launches ARMv9

March 30, 2021May 23, 2021 David Schor
TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

June 22, 2019May 25, 2021 David Schor
Samsung 17nm follows Intel 16

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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