Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding
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Foveros
Intel Launches Lakefield: An Experiment With Multiple New Technologies
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC
A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects
Intel is expanding its packaging portfolio with more advanced 2.5D and 3D technologies including multiple 3D stacks and omnidirectional interconnects.
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Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips
Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes
At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.
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