A Look At Qualcomm’s Data Center Inference Accelerator
A look at Qualcomm’s Data Center Inference Accelerator, the Cloud AI 100.
Read moreA look at Qualcomm’s Data Center Inference Accelerator, the Cloud AI 100.
Read moreThe IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.
Read moreIBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32.
Read moreA look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
Read moreIntegrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.
Read moreA look at the Habana inference and training neural processors designed for the acceleration of data center workloads.
Read moreA look at Cerebras Wafer-Scale Engine (WSE), a chip the size of a wafer, packing over 400K tiny AI cores using 1.2 trillion transistors on a half square foot of silicon.
Read moreA look at the microarchitecture of Intel Nervana next-generation data center training neural processor, codename Spring Crest.
Read moreIBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.
Read moreFirst detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
Read more