WikiChip Fuse
ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

A look at AMD’s Zeppelin SoC and the Infinity Fabric, a multi-chip architecture used by AMD to scale their SoC design from the mainstream PC market all the way to the server market.

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ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

In recent years, IoT devices have been plagued with security issues. Memory and energy constraints of those low-power devices mean there is very little headroom for complex security implementations. At ISSCC 2018, a team of MIT researchers has attempted to address this problem with their low-power fully in-hardware crypto engine IoT RISC-V processor.

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ISSCC 2018: Intel’s Skylake-SP Mesh and  Floorplan

At ISSCC 2018 Intel gave us some more interesting architectural details of their latest Skylake server microprocessors which brought a new mesh interconnect, a new cache hierarchy, and wider vector operations among a large array of other enhancements.

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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects

At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.

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