Your Chips and Semi News
Intel is launching their next-generation data center infrastructure product portfolio including Cascade Lake with up to 56 cores, new lower-power Hewitt Lake processors, Optane DC SSD and persistent memory DIMMs, as well as 100 Gb Ethernet.
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Affirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.
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Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
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IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
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Arm outlines server strategy with an ambitious plan to make a dent in the data center business that is dominated by Intel through standardization and a new roadmap with high-performance ‘server-class’ cores.
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Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.
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A look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.
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A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.
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BrainChip discloses Akida, a Neuromorphic System-on-Chip for the edge and server.
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Partnering up with Lenovo, ARM server startup Ampere has announced their first-generation eMAG microprocessors are now shipping.
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