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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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TSMC

Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor 2023 2023 Technology Symposium, 3 nm, IEDM, IEDM 2022, N3, N3B, N3E, TSMC, TSMC Technology Symposium

A Look At TSMC N3 Process

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Foundries IEDM 2022 

IEDM 2022: Did We Just Witness The Death Of SRAM?

December 14, 2022December 15, 2022 David Schor 3 nm, cache, IEDM, N3, N3B, N3E, SRAM, TSMC

IEDM 2022: Did we just witness the death of SRAM? While foundries continue to show strong logic transistor scaling, SRAM scaling has completely collapsed.

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Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

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Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor 3 nm, FinFlex, N3, N3E, TSMC

TSMC outlines a number of 3-nanometer class node changes and flavors.

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Foundries Process Technologies Roadmaps 

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

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Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor 5 nm, Alibaba, Apsara Conference 2021, ARM, ARMv9, Panjiu, RISC-V, T-Head, TSMC, Xuantie, Yitian 710

Alibaba open-source its high-performance XuanTie RISC-V Cores; introduces a new in-house Armv9 server chip

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Packaging Subscriber Only Content 

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.

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Architectures Manycore Processors 

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021August 2, 2021 David Schor 7 nm, Esperanto, ET-Maxion, ET-Minion, ET-SoC-1, neural processors, RISC-V, TSMC

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N2 2 nm, N3, N4, N5, N6, N7, subscriber only (general), TSMC

TSMC 2021 foundry update

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Foundries 

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

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  • ← Previous

Top Six Articles

  • TSMC Details 5 nm
  • Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers
  • TSMC N3, And Challenges Ahead
  • ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • A Look At Intel 4 Process Technology

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor
VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

June 17, 2018May 25, 2021 David Schor
AMD Discloses Initial Zen 2 Details

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor
ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

April 2, 2018May 25, 2021 David Schor
Hot Chips 30: AMD Raven Ridge

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

TSMC 2021 Foundry Update: Foundry Roadmap

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor
TSMC 5-Nanometer Update

TSMC 5-Nanometer Update

November 1, 2019May 25, 2021 David Schor
ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

March 17, 2018May 25, 2021 David Schor
A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

June 15, 2018May 25, 2021 David Schor
Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor
The Magnets Under the Icy Lake

The Magnets Under the Icy Lake

May 23, 2021July 8, 2021 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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