Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
Read moreAn outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
Read moreLast week Huawei expanded their Kunpeng CPU family of custom Arm server processors with more models and new servers.
Read moreAffirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.
Read moreLast week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
Read moreAt the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.
Read moreIBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
Read moreArm outlines server strategy with an ambitious plan to make a dent in the data center business that is dominated by Intel through standardization and a new roadmap with high-performance ‘server-class’ cores.
Read moreSamsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
Read moreA look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.
Read moreCambricon has announced their first high-performance and high-power AI accelerator for the data center in an effort to gain market share in the growing Chinese AI market.
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