AMD Announces 3rd Gen Ryzen Threadripper
AMD announces 3rd-generation Ryzen Threadripper microprocessors with up to 32 cores.
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Author: David Schor
Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies
Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.
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IBM Adds POWER9 AIO, Pushes for an Open Memory-Agnostic Interface
IBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.
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TSMC 5-Nanometer Update
An update on TSMC’s upcoming 5-nanometer process technology.
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Intel Core i9-9900KS Special Edition Full Specs and Availability Announced
Intel announces the full specification, pricing, and availability of the Core i9-9900KS Special Edition.
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Intel Unveils the Tremont Microarchitecture: Going After ST Performance
Intel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.
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Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator
First detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
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Samsung 5 nm and 4 nm Update
Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.
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Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET
Intel expands its 22FFL process with new production-ready MRAM and RRAM technologies.
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ASML Starts NXE:3400C Shipment, But Supply Constraints Loom
ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
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