Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
Read moreAn outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
Read moreIntel has introduced their next-generation flagship data center FPGAs based on their 10-nanometer process. Utilizing a chiplet-based architecture, the company hopes to better customize the product for customer’s demand while iterating faster on PHYs and other connectivity protocols.
Read morePresented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.
Read moreLast week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
Read moreAt the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.
Read moreA look at Samsung’s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.
Read moreWikiChip takes another look at Intel’s 10-nanometer standard cell design and discusses TechInsights findings of the first 10nm-based chip, the i3-8121U.
Read moreQualcomm has launched the first premium mid-range SoC from the new Snapdragon 700 series.
Read moreIntel has silently launched the first 10nm-based Cannon Lake SKU.
Read moreGoing after the growing intelligent IoT market, Qualcomm is introducing a new Vision Intelligence Platform for accelerating camera vision processing in smart IoT applications.
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