Your Chips and Semi News
7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
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An update on TSMC’s upcoming 5-nanometer process technology.
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TSMC announces its N7+ process which entered HVM earlier this year is now shipping products to market.
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An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.
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An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
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Ahead of the highly anticipated Ryzen 3000 desktop series launch, here is a look at the AMD Zen 2 core microarchitecture.
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A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.
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Update and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.
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A leaked roadmap of Intel server processors reveals some new details about their next-generation Sapphire Rapids and Granite Rapids processors.
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A look at Ice Lake mobile CPUs which bring a new CPU core, a new Gen11 GPU, and a new 4th Gen IPU as well the new roadmap detailed by Intel at their recent investor meeting which includes Xeon Sapphire Rapids CPUs and 7nm Xe Data Center GPGPUs for 2021.
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