TSMC N3, And Challenges Ahead
A Look At TSMC N3 Process
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IEDM
IEDM 2022: Did We Just Witness The Death Of SRAM?
IEDM 2022: Did we just witness the death of SRAM? While foundries continue to show strong logic transistor scaling, SRAM scaling has completely collapsed.
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Intel Talks 10nm DTCO, EUV Benefits
Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
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TSMC Digs Trenches In Search Of Higher Performance
TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.
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IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery
Presented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.
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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.
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IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology
At the 2017 IEDM Sony presented their 3-layer stacked state-of-the-art CMOS image sensor (CIS) technology used to minimize rolling shutter distortions and greatly increase the read speed and thus fps through the use of DRAM for temporarily storing the pixel data.
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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV
At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.
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IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps
At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.
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