7nm Boosted Zen 2 Capabilities but Doubled the Challenges
The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.
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Conferences
Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
A dive into the Rosetta ASIC switch, the engine behind Cray’s new Slingshot interconnect powering the upcoming Shasta exascale supercomputers.
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Arm Ethos is for Ubiquitous AI At the Edge
Arm’s Ethos family takes aim at ubiquitous AI with NPUs for ultra-low power IoT to high-performance smartphones and AR/VR.
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Ayar Labs Realizes Co-Packaged Silicon Photonics
Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.
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A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC
A look at the 496-core RISC-V manycore array, network-on-chip, and the digital PLL of the Celerity open-source RISC-V tiered accelerator.
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AMD Launches New Entry-Level Mobile ‘Dali’ Processors
AMD launches new value and entry-level mobile processors, codenamed Dali.
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OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates
A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposers and bridges.
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A Look At The Habana Inference And Training Neural Processors
A look at the Habana inference and training neural processors designed for the acceleration of data center workloads.
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TSMC Digs Trenches In Search Of Higher Performance
TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.
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Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029
Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.
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