Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles
Samsung tapes out 3nm GAA test vehicle as it inches towards mass production
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Process Technologies
TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap
A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.
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TSMC 2021 Foundry Update: Foundry Roadmap
TSMC 2021 foundry update
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Intel Talks 10nm DTCO, EUV Benefits
Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
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Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year
Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter
TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.
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TSMC Details 5 nm
TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.
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TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications
TSMC announces an enhancement to its CoWoS packaging technology with support for up to 2x the reticle size. The new technology is ready for next-generation 5-nanometer HPC applications.
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TSMC Digs Trenches In Search Of Higher Performance
TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.
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