Arm Unveils the Cortex-A78: When Less Is More
Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.
Read moreArm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.
Read moreArm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program.
Read moreNEC readies 2nd-generation Vector Engine, Type 20, offering higher memory bandwidth and a few more vector cores.
Read moreA look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
Read moreIBM doubles its 14-nanometer eDRAM density through physical design work, enabling the packing of hundreds of additional megabytes of cache on the latest z15 microprocessor and system controller.
Read moreCEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreA look at AMD’s Radeon RX 5700 GPU built on a 7-nanometer process based on the new Navi microarchitecture and RDNA graphics architecture.
Read moreThe transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.
Read moreArm launches two new IPs for deeply-embedded AI: the Cortex-M55 with the new M-Profile Vector Extension (Helium), and the Ethos-U55, an ultra-low-power dedicated NPU for embedded applications.
Read moreA dive into the Rosetta ASIC switch, the engine behind Cray’s new Slingshot interconnect powering the upcoming Shasta exascale supercomputers.
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