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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Architectures

Architectures Mobile Processors 

Arm Unveils the Cortex-A78: When Less Is More

May 26, 2020May 23, 2021 David Schor 5 nm, ARM, ARMv8.2, Cortex, Cortex-A77, Cortex-A78

Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.

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Architectures Mobile Processors 

Arm Cortex-X1: The First From The Cortex-X Custom Program

May 26, 2020May 23, 2021 David Schor 5 nm, ARM, ARMv8.2, Cortex, Cortex-A78, Cortex-X, Cortex-X1

Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program.

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Architectures Vector Processors 

NEC Readies 2nd Gen Vector Engine

May 15, 2020May 23, 2021 David Schor NEC, SX series, SX-Aurora, Vector Engine (VE), vector processors

NEC readies 2nd-generation Vector Engine, Type 20, offering higher memory bandwidth and a few more vector cores.

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Architectures Hot Chips 31 IEDM 2019 ISSCC 2020 

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Foveros, Intel, Lakefield, Sunny Cove, Tremont

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

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Architectures Circuit Design ISSCC 2020 

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

March 8, 2020May 25, 2021 David Schor 14HP, cache, eDRAM, IBM, IBM Z, ISSCC, ISSCC 2020, z/Architecture, z14, z15

IBM doubles its 14-nanometer eDRAM density through physical design work, enabling the packing of hundreds of additional megabytes of cache on the latest z15 microprocessor and system controller.

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Architectures Circuit Design ISSCC 2020 Manycore Processors Server Processors 

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor 28nm, 65 nm, active interposer, CEA-Leti, chiplet, interconnects, interposer, ISSCC, ISSCC 2020, multi-chip package, STMicroelectronics

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.

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Architectures Circuit Design Graphics Processors ISSCC 2020 

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor 7 nm, AMD, ISSCC, ISSCC 2020, N7P, Navi, Radeon, Radeon RX 5700

A look at AMD’s Radeon RX 5700 GPU built on a 7-nanometer process based on the new Navi microarchitecture and RDNA graphics architecture.

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Architectures Floorplanning Interconnects ISSCC 2020 

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor 14 nm, 7 nm, AMD, capacitance, GlobalFoundries, ISSCC, ISSCC 2020, resistance, TSMC, wire delay, Zen, Zen 2

The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.

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Architectures Neural Processors 

Arm Launches the Cortex-M55 and Its MicroNPU Companion, the Ethos-U55

February 10, 2020May 25, 2021 David Schor ARM, Arm Ethos, Cortex, Cortex-M55, inference, neural processors

Arm launches two new IPs for deeply-embedded AI: the Cortex-M55 with the new M-Profile Vector Extension (Helium), and the Ethos-U55, an ultra-low-power dedicated NPU for embedded applications.

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Architectures Hot Interconnects 26 Interconnects Supercomputers 

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect

February 9, 2020May 25, 2021 David Schor 16 nm, Cray, Cray Shasta, Cray Slingshot, Ethernet switch, Hot Interconnects, Hot Interconnects 26

A dive into the Rosetta ASIC switch, the engine behind Cray’s new Slingshot interconnect powering the upcoming Shasta exascale supercomputers.

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Top Six Articles

  • A look at Nvidia’s NVLink interconnect and the NVSwitch
  • TSMC N3, And Challenges Ahead
  • Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem
  • Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
  • Arm Unveils the Cortex-A78: When Less Is More
  • Arm Unveils Cortex-A77, Emphasizes Single-Thread Performance

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Intel Silently Launches Cannon Lake

Intel Silently Launches Cannon Lake

May 15, 2018May 25, 2021 David Schor
5th Gen CoWoS-S Extends 3 Reticle Size

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor
Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor
Ayar Labs Realizes Co-Packaged Silicon Photonics

Ayar Labs Realizes Co-Packaged Silicon Photonics

January 19, 2020May 25, 2021 David Schor
Intel to launch Skylake-D in Q1 2018, followed by Xeons with integrated FPGA

Intel to launch Skylake-D in Q1 2018, followed by Xeons with integrated FPGA

November 26, 2017May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

AMD Launches Ryzen PRO 3000 Series

AMD Launches Ryzen PRO 3000 Series

October 3, 2019May 25, 2021 David Schor
Arm Ethos is for Ubiquitous AI At the Edge

Arm Ethos is for Ubiquitous AI At the Edge

February 6, 2020May 25, 2021 David Schor
AMD’s Zen CPU Complex, Cache, and SMU

AMD’s Zen CPU Complex, Cache, and SMU

April 18, 2018May 25, 2021 David Schor
Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

July 24, 2018May 25, 2021 David Schor
A Look At Intel 4 Process Technology

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor
Chuck Peddle: Personal Computer Pioneer, Dies At 82

Chuck Peddle: Personal Computer Pioneer, Dies At 82

December 24, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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