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  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor

Subscriber-Only ContentView All

Our latest subscriber-only content. Our patrons enjoy early-bird access to some of our content.

A Look At AMD’s 3D-Stacked V-Cache
Circuit Design Desktop Processors Interconnects Packaging Server Processors Subscriber Only Content 

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

TSMC Demos SoIC_H for High-Bandwidth HPC Applications
Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
The NPU Inside Every Intel PC
Architectures Neural Processors Subscriber Only Content 

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor
Samsung Foundry On EUV, Pellicles, Capacity, and Yield
Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor

ArchitecturesView All

Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor

Arm unveils its 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor

Arm launches its next-generation big core, the Cortex-A725

Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor

Arm launches its next-generation flagship processor, the Cortex-X925

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

Arm Introduces Its Newest Flagship Performance Core, The Cortex-X4

Process TechnologyView All

Our latest coverage from the semiconductor world including recent announcements and analysis of new process nodes from semiconductor foundries including Intel, TSMC, Samsung, GlobalFoundries, and other.

TSMC N3, And Challenges Ahead
Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor

A Look At TSMC N3 Process

N3E Replaces N3; Comes In Many Flavors
Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor
A Look At Intel 4 Process Technology
Foundries Process Technologies VLSI 2022 

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor

SupercomputersView All

The latest chip-related news from the world of HPC and supercomputers.

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
Architectures Hot Interconnects 26 Interconnects Supercomputers 

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip
Architectures Neural Processors Supercomputers Supercomputing 19 

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio
Architectures Roadmaps Server Processors Supercomputers Supercomputing 19 

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

Cavium Takes ARM to Petascale with Astra
Supercomputers 

Cavium Takes ARM to Petascale with Astra

Fujitsu Completes Post-K ARM CPU Prototype
Supercomputers 

Fujitsu Completes Post-K ARM CPU Prototype

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest
Supercomputers 

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer
Server Processors Supercomputers 

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges
Supercomputers 

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

ConferencesView All

  • TSMC N3, And Challenges Ahead
    Foundries IEDM 2022 Interconnects Process Technologies 

    TSMC N3, And Challenges Ahead

  • IEDM 2022: Did We Just Witness The Death Of SRAM?
    Foundries IEDM 2022 

    IEDM 2022: Did We Just Witness The Death Of SRAM?

  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
    AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors 

    SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

  • A Look At Samsung’s 4LPE Process
    Foundries IEDM 2021 Process Technologies Subscriber Only Content 

    A Look At Samsung’s 4LPE Process

  • A Look At Intel 4 Process Technology
    Foundries Process Technologies VLSI 2022 

    A Look At Intel 4 Process Technology

TSMC N3, And Challenges AheadTSMC N3, And Challenges AheadIEDM 2022: Did We Just Witness The Death Of SRAM?IEDM 2022: Did We Just Witness The Death Of SRAM?SiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsSiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsA Look At Samsung’s 4LPE ProcessA Look At Samsung’s 4LPE ProcessA Look At Intel 4 Process TechnologyA Look At Intel 4 Process Technology
IEDM 2017 Processors 

IEDM 2017: AMD’s grand vision for the future of HPC

December 5, 2017May 25, 2021 David Schor 2.5D packaging, 3D packaging, AMD, HBM, IEDM, IEDM 2017, Moore's Law, Packaging

Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.

Read more
Process Technologies 

Samsung 2nd gen 10nm enters HVM, S3 fab ready for primetime

November 29, 2017May 25, 2021 David Schor 10LPP, 10nm, 7LPP, 7nm, 8LPP, 8nm, EUV, Samsung

Samsung has announced that its 2nd generation 10nm process has entered mass production. The company also announced that their S3-Line fab in South Korea is ready to ramp up production.

Read more
Server Processors 

Intel to launch Skylake-D in Q1 2018, followed by Xeons with integrated FPGA

November 26, 2017May 25, 2021 David Schor FPGA, Intel, Skylake-DE, x86, Xeon D, Xeon Scalable

Intel confirms the launch of energy-efficient Xeon D processors based on Skylake for early 2018 which will be followed by Xeon with integrated FPGAs.

Read more
Desktop Processors Mobile Processors 

8th Gen Coffee Lake and 9th Gen Lineup

November 24, 2017May 25, 2021 David Schor Coffee Lake, Core i3, Core i5, Core i7, Ice Lake, Intel, x86, Xeon E

The rest of the Coffee Lake lineup as well as what appears to be Ice Lake lineup has been revealed by the AIDA64 changelog. The list includes a flagship mobile Core i9 processor and 9th generation Ice Lake SKUs.

Read more
Supercomputers 

TOP500 50th List Anniversary: A Visualized Breakdown

November 14, 2017May 25, 2021 David Schor Intel, Linux, Nvidia, statistics, Supercomputers, TOP500

TOP500.org is celebrating its 50th list anniversary. But what does the list actually looks like? We have compiled some statistics to give you an insight into the list.

Read more
Supercomputers 

Intel axes Knights Hill, plans a new microarchitecture for exascale

November 14, 2017May 25, 2021 David Schor 10nm, Aurora, Cray, DoE, exascale, Intel, x86

In preparation for the United States’ first exascale supercomputer, Intel announces they are cancelling next-generation Xeon Phi processors (codename Knights Hill) in favor of a brand new platform and microarchitecture specifically designed for exascale.

Read more
Supercomputers 

PEZY dominates the new Green500 list

November 13, 2017May 25, 2021 David Schor Green500, PEZY, PEZY-SCx, Supercomputers

With the newly published Green500 list, Japan dominates the most power-efficient supercomputer list thanks to the ZettaScaler-2.2 architecture and PEZY’s PEZY-SC2 many-core processor.

Read more
Desktop Processors 

Core i7-8700K overclockability silicon lottery stats

November 12, 2017May 25, 2021 David Schor Coffee Lake, Core i7, Intel, Silicon Lottery, x86, Yield

Silicon Lottery has published new statistics regarding the overclockability of Intel’s hexa-core Core i7-8700K desktop processor.

Read more
Mobile Processors 

Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

November 10, 2017May 25, 2021 David Schor 10LPP, 10nm, ARM, Exynos, Samsung

Samsung has quietly unveiled its latest flagship processor, the Exynos 9 Series 9810, which will succeed the Exynos 9 Series 8895 found in the Galaxy S8, S8+, and the Note 8.

Read more
Neural Processors 

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

November 8, 2017May 25, 2021 David Schor 28HPC+, accelerator, AI, ASIC, Bitmain Technologies, neural processors, Xilinx

The ASIC Bitcoin design company Bitmain has announced they are entering the AI market with their new custom design BM1680 neural processor which will be at the heart of the new Sophon family of AI PCIe accelerator cards and full servers.

Read more
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Top Six Articles

  • TSMC N3, And Challenges Ahead
  • TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • A Look At Intel 4 Process Technology
  • TSMC Details 5 nm

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Radeon RX 5700: Navi and the RDNA Architecture

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor
A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor
ISSCC 2018: The IBM z14 Microprocessor And System Control Design

ISSCC 2018: The IBM z14 Microprocessor And System Control Design

May 13, 2018May 25, 2021 David Schor
A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip

A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip

November 16, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

5th Gen CoWoS-S Extends 3 Reticle Size

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor
Intel Announces 10th Gen Core Processors Based On 10nm Ice Lake, Now Shipping

Intel Announces 10th Gen Core Processors Based On 10nm Ice Lake, Now Shipping

May 28, 2019May 25, 2021 David Schor
Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

August 1, 2019May 25, 2021 David Schor
Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

December 22, 2018May 25, 2021 David Schor
TSMC Announces 6-Nanometer Process

TSMC Announces 6-Nanometer Process

April 16, 2019May 25, 2021 David Schor
Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and  112G Transceivers

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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