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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

David SchorIEDM 2017, Process TechnologiesDecember 21, 2017 Tagged 7LP, 7nm, AMD, EUV, FinFET, GlobalFoundries, IBM, IEDM, IEDM 2017, process technology, SADP, SAQP

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

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IEDM 2017: AMD’s grand vision for the future of HPC

David SchorIEDM 2017, ProcessorsDecember 5, 2017 Tagged 2.5D packaging, 3D packaging, AMD, HBM, IEDM, IEDM 2017, Moore's Law, Packaging

Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.

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Intel to leverage EMIBs to create mobile processors with discrete AMD graphics

David SchorMobile ProcessorsNovember 7, 2017 Tagged 3D packaging, AMD, CPU, EMIB, GPU, HBM, Intel, TSV, x86

Intel has announced they will be introducing an 8th generation processor featuring a discrete AMD Radeon GPU along with HBM2. Using Intel’s new EMIB packaging interconnect technology, the single-chip solution provides higher performance while delivering a smaller form factor than comparable solutions.