AMD – Page 2 – WikiChip Fuse

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor 14 nm, 7 nm, AMD, Rome, x86, Zen, Zen 2, Zen 4

Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.

Circuit Design Hot Chips 30 Packaging

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

Architectures Circuit Design Hot Chips 30

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen

Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.

Desktop Processors

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

August 7, 2018May 25, 2021 David Schor 12LP, 12nm, AMD, HEDT, Ryzen Threadripper, x86, Zen

AMD announces their second-generation Threadripper processors with up to 32 cores based on their 12nm Zen+ microarchitecture.

Architectures Circuit Design ISSCC 2018

AMD’s Zen CPU Complex, Cache, and SMU

April 18, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, cache, floorplan, ISSCC, ISSCC 2017, ISSCC 2018, SRAM, x86, Zen

A look at AMD’s Zen CPU Complex (CCX), a fully independent and modular cluster of up to four cores that are incorporated into a full SoC to form complete products such as their Zeppelin die.

Desktop Processors

AMD introduces Ryzen 2nd Gen up for pre-order

April 13, 2018May 25, 2021 David Schor 14 nm, AMD, Ryzen, x86, Zen

Ahead of its April 19th release, AMD is now offering pre-orders for their 2nd Generation, Ryzen 2000 family, desktop processors.

Architectures Circuit Design Floorplanning ISSCC 2018

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor 14 nm, 2D packaging, AMD, AMD's infinity fabric, EPYC, multi-chip package, Ryzen, x86, Zen

A look at AMD’s Zeppelin SoC and the Infinity Fabric, a multi-chip architecture used by AMD to scale their SoC design from the mainstream PC market all the way to the server market.

Embedded Processors Server Processors

AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

February 23, 2018May 25, 2021 David Schor 14 nm, AMD, edge computing, EPYC, Ryzen, Vega, x86, Zen

After covering the server and PC markets, AMD has ventured into the edge-computing and embedded market with their latest Zen microarchitecture with the launch of two low-power embedded microprocessor families.

CES 2018 Processors

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

CES 2018 Mobile Processors

Intel launches 8th Gen Core with Radeon RX Vega Graphics

January 7, 2018May 25, 2021 David Schor 14 nm, AMD, EMIB, GPU, HBM, Intel, Kaby Lake, Radeon, x86

At CES 2018 Intel announced the first series of the much anticipated Core i5 and i7 chips with Radeon graphics. Those parts incorporate a Kaby Lake microprocessor, a Vega M GPU, and 4 GiB of HBM2 cache.