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AMD

Architectures Server Processors 

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor 14 nm, 7 nm, AMD, Rome, x86, Zen, Zen 2, Zen 4

Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.

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Circuit Design Hot Chips 30 Packaging 

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

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Architectures Circuit Design Hot Chips 30 

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen

Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.

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Desktop Processors 

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

August 7, 2018May 25, 2021 David Schor 12LP, 12nm, AMD, HEDT, Ryzen Threadripper, x86, Zen

AMD announces their second-generation Threadripper processors with up to 32 cores based on their 12nm Zen+ microarchitecture.

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Architectures Circuit Design ISSCC 2018 

AMD’s Zen CPU Complex, Cache, and SMU

April 18, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, cache, floorplan, ISSCC, ISSCC 2017, ISSCC 2018, SRAM, x86, Zen

A look at AMD’s Zen CPU Complex (CCX), a fully independent and modular cluster of up to four cores that are incorporated into a full SoC to form complete products such as their Zeppelin die.

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Desktop Processors 

AMD introduces Ryzen 2nd Gen up for pre-order

April 13, 2018May 25, 2021 David Schor 14 nm, AMD, Ryzen, x86, Zen

Ahead of its April 19th release, AMD is now offering pre-orders for their 2nd Generation, Ryzen 2000 family, desktop processors.

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Architectures Circuit Design Floorplanning ISSCC 2018 

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor 14 nm, 2D packaging, AMD, AMD's infinity fabric, EPYC, multi-chip package, Ryzen, x86, Zen

A look at AMD’s Zeppelin SoC and the Infinity Fabric, a multi-chip architecture used by AMD to scale their SoC design from the mainstream PC market all the way to the server market.

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Embedded Processors Server Processors 

AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

February 23, 2018May 25, 2021 David Schor 14 nm, AMD, edge computing, EPYC, Ryzen, Vega, x86, Zen

After covering the server and PC markets, AMD has ventured into the edge-computing and embedded market with their latest Zen microarchitecture with the launch of two low-power embedded microprocessor families.

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CES 2018 Processors 

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

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CES 2018 Mobile Processors 

Intel launches 8th Gen Core with Radeon RX Vega Graphics

January 7, 2018May 25, 2021 David Schor 14 nm, AMD, EMIB, GPU, HBM, Intel, Kaby Lake, Radeon, x86

At CES 2018 Intel announced the first series of the much anticipated Core i5 and i7 chips with Radeon graphics. Those parts incorporate a Kaby Lake microprocessor, a Vega M GPU, and 4 GiB of HBM2 cache.

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Top Six Articles

  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
  • The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids
  • TSMC 2021 Foundry Update: Foundry Roadmap
  • Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
  • AMD 3D Stacks SRAM Bumplessly

Recent

  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    November 20, 2021November 20, 2021 David Schor
  • Intel Launches 12th Gen Core Desktop Alder Lake Processors

    Intel Launches 12th Gen Core Desktop Alder Lake Processors

    October 27, 2021November 3, 2021 David Schor

Random Picks

Intel Updates Apollo Lake: More LPC Reliability Issues

Intel Updates Apollo Lake: More LPC Reliability Issues

September 9, 2019May 25, 2021 David Schor
Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

May 13, 2021May 23, 2021 David Schor
Arm’s New Cortex-M55 Breathes Helium

Arm’s New Cortex-M55 Breathes Helium

June 20, 2020May 23, 2021 David Schor
Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

April 20, 2018May 25, 2021 David Schor
ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

June 16, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 12nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 edge computing EMIB EUV FinFET Foveros GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

The RISC-V momentum continues with the GAP8, a new IoT/AI Application Processor

The RISC-V momentum continues with the GAP8, a new IoT/AI Application Processor

February 28, 2018May 25, 2021 David Schor
ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

June 16, 2018May 25, 2021 David Schor
MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

May 25, 2018May 25, 2021 Matt Larson
AMD’s Zen CPU Complex, Cache, and SMU

AMD’s Zen CPU Complex, Cache, and SMU

April 18, 2018May 25, 2021 David Schor

IBM Open Sources Power ISA, Delays POWER10 to 2021

September 12, 2019May 25, 2021 David Schor
Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

May 11, 2019May 25, 2021 David Schor
Inside Tesla’s Neural Processor In The FSD Chip

Inside Tesla’s Neural Processor In The FSD Chip

September 22, 2019July 11, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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