TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC
A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.
Read moreA look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.
Read moreUpdate and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.
Read morePresented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.
Read moreArm outlines server strategy with an ambitious plan to make a dent in the data center business that is dominated by Intel through standardization and a new roadmap with high-performance ‘server-class’ cores.
Read moreA look at the NEC SX-Aurora, their latest vector processor – increasing compute while maintaining a high B/F through six HBM2 modules leveraging TSMC 2nd gen CoWoS technology. The SX-Aurora introduces a new form factor, system architecture, and execution model.
Read moreA look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.
Read moreSamsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
Read moreA look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.
Read morePresented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.
Read moreA look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.
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