TSMC Demos SoIC_H for High-Bandwidth HPC Applications
[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.
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3D packaging
Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding
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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
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AMD 3D Stacks SRAM Bumplessly
AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
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Intel Launches Lakefield: An Experiment With Multiple New Technologies
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC
A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications
GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.
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TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.
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Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects
Intel is expanding its packaging portfolio with more advanced 2.5D and 3D technologies including multiple 3D stacks and omnidirectional interconnects.
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