AMD Announces 3rd Gen Ryzen Threadripper
AMD announces 3rd-generation Ryzen Threadripper microprocessors with up to 32 cores.
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A Look At AMD’s 3D-Stacked V-Cache
[Subscription] A technical look at AMD’s 3D-Stacked V-Cache
ArchitecturesView All
Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
Arm unveils its 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
Arm Launches Next-Gen Big-Core: Cortex-A725
Arm launches its next-generation big core, the Cortex-A725
Arm Launches Next-Gen Flagship Cortex-X925
Arm launches its next-generation flagship processor, the Cortex-X925
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Arm Introduces Its Newest Flagship Performance Core, The Cortex-X4
Process TechnologyView All
Our latest coverage from the semiconductor world including recent announcements and analysis of new process nodes from semiconductor foundries including Intel, TSMC, Samsung, GlobalFoundries, and other.
TSMC N3, And Challenges Ahead
A Look At TSMC N3 Process
SupercomputersView All
The latest chip-related news from the world of HPC and supercomputers.
ConferencesView All
Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies
Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.
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IBM Adds POWER9 AIO, Pushes for an Open Memory-Agnostic Interface
IBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.
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TSMC 5-Nanometer Update
An update on TSMC’s upcoming 5-nanometer process technology.
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Intel Core i9-9900KS Special Edition Full Specs and Availability Announced
Intel announces the full specification, pricing, and availability of the Core i9-9900KS Special Edition.
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Intel Unveils the Tremont Microarchitecture: Going After ST Performance
Intel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.
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Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator
First detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
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Samsung 5 nm and 4 nm Update
Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.
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Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET
Intel expands its 22FFL process with new production-ready MRAM and RRAM technologies.
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ASML Starts NXE:3400C Shipment, But Supply Constraints Loom
ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
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