Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
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3D packaging
Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes
At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.
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A Look at NEC’s Latest Vector Processor, the SX-Aurora
A look at the NEC SX-Aurora, their latest vector processor – increasing compute while maintaining a high B/F through six HBM2 modules leveraging TSMC 2nd gen CoWoS technology. The SX-Aurora introduces a new form factor, system architecture, and execution model.
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Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem
Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
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Hot Chips 30: Intel Kaby Lake G
A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.
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QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor
Attempting to address the memory bandwidth problem, the QUEST neural processor uses 3D-stacked SRAM dies along with ThruChip Interface wireless communication technology to deliver sufficiently high bandwidth to sustain peak processing performance.
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IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology
At the 2017 IEDM Sony presented their 3-layer stacked state-of-the-art CMOS image sensor (CIS) technology used to minimize rolling shutter distortions and greatly increase the read speed and thus fps through the use of DRAM for temporarily storing the pixel data.
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IEDM 2017: AMD’s grand vision for the future of HPC
Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.
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Intel to leverage EMIBs to create mobile processors with discrete AMD graphics
Intel has announced they will be introducing an 8th generation processor featuring a discrete AMD Radeon GPU along with HBM2. Using Intel’s new EMIB packaging interconnect technology, the single-chip solution provides higher performance while delivering a smaller form factor than comparable solutions.
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The 2,048-core PEZY-SC2 sets a Green500 record
PEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s.
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