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  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor

Subscriber-Only ContentView All

Our latest subscriber-only content. Our patrons enjoy early-bird access to some of our content.

A Look At AMD’s 3D-Stacked V-Cache
Circuit Design Desktop Processors Interconnects Packaging Server Processors Subscriber Only Content 

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

TSMC Demos SoIC_H for High-Bandwidth HPC Applications
Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
The NPU Inside Every Intel PC
Architectures Neural Processors Subscriber Only Content 

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor
Samsung Foundry On EUV, Pellicles, Capacity, and Yield
Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor

ArchitecturesView All

Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor

Arm unveils its 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor

Arm launches its next-generation big core, the Cortex-A725

Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor

Arm launches its next-generation flagship processor, the Cortex-X925

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

Arm Introduces Its Newest Flagship Performance Core, The Cortex-X4

Process TechnologyView All

Our latest coverage from the semiconductor world including recent announcements and analysis of new process nodes from semiconductor foundries including Intel, TSMC, Samsung, GlobalFoundries, and other.

TSMC N3, And Challenges Ahead
Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor

A Look At TSMC N3 Process

N3E Replaces N3; Comes In Many Flavors
Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
A Look At Samsung’s 4LPE Process
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor
A Look At Intel 4 Process Technology
Foundries Process Technologies VLSI 2022 

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor

SupercomputersView All

The latest chip-related news from the world of HPC and supercomputers.

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
Architectures Hot Interconnects 26 Interconnects Supercomputers 

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip
Architectures Neural Processors Supercomputers Supercomputing 19 

Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio
Architectures Roadmaps Server Processors Supercomputers Supercomputing 19 

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

Cavium Takes ARM to Petascale with Astra
Supercomputers 

Cavium Takes ARM to Petascale with Astra

Fujitsu Completes Post-K ARM CPU Prototype
Supercomputers 

Fujitsu Completes Post-K ARM CPU Prototype

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest
Supercomputers 

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer
Server Processors Supercomputers 

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges
Supercomputers 

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

ConferencesView All

  • TSMC N3, And Challenges Ahead
    Foundries IEDM 2022 Interconnects Process Technologies 

    TSMC N3, And Challenges Ahead

  • IEDM 2022: Did We Just Witness The Death Of SRAM?
    Foundries IEDM 2022 

    IEDM 2022: Did We Just Witness The Death Of SRAM?

  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
    AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors 

    SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

  • A Look At Samsung’s 4LPE Process
    Foundries IEDM 2021 Process Technologies Subscriber Only Content 

    A Look At Samsung’s 4LPE Process

  • A Look At Intel 4 Process Technology
    Foundries Process Technologies VLSI 2022 

    A Look At Intel 4 Process Technology

TSMC N3, And Challenges AheadTSMC N3, And Challenges AheadIEDM 2022: Did We Just Witness The Death Of SRAM?IEDM 2022: Did We Just Witness The Death Of SRAM?SiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsSiFive Introduces A New Coprocessor Interface, Targets Custom AcceleratorsA Look At Samsung’s 4LPE ProcessA Look At Samsung’s 4LPE ProcessA Look At Intel 4 Process TechnologyA Look At Intel 4 Process Technology
Circuit Design Hot Chips 30 Packaging 

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

Read more
Architectures Floorplanning Hot Chips 30 

Hot Chips 30: Nvidia Xavier SoC

September 8, 2018May 25, 2021 David Schor 12FFN, 12nm, AI, ARM, ARMv8, inference, neural processors, Nvidia, NVLink, Tegra, Xavier

An overview of the Xavier SoC which was detailed by Nvidia at Hot Chips 30.

Read more
Architectures Circuit Design Hot Chips 30 

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen

Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.

Read more
Supercomputers 

Cavium Takes ARM to Petascale with Astra

August 25, 2018May 25, 2021 David Schor ARM, ARMv8, Cavium, DoE, HPC, Marvell, Sandia, Supercomputers, ThunderX, ThunderX2, Vulcan

A look at the Astra supercomputer, the most powerful ARM-based supercomputer being built for Sandia National Labs.

Read more
Desktop Processors 

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

August 7, 2018May 25, 2021 David Schor 12LP, 12nm, AMD, HEDT, Ryzen Threadripper, x86, Zen

AMD announces their second-generation Threadripper processors with up to 32 cores based on their 12nm Zen+ microarchitecture.

Read more
Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

Read more
ERI Summit 2018 Interconnects 

Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

July 24, 2018May 25, 2021 David Schor Advanced Interface Bus (AIB), DARPA, EMIB, Intel, interconnects, Packaging

At the DARPA 2018 ERI Summit, Intel announced their contribution of a royalty-free bus standard to DARPA’s CHIPS Program, allowing seamless communication between multiple packaged chiplets.

Read more
Foundries Process Technologies VLSI 2018 

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

July 22, 2018May 25, 2021 David Schor 12 nm, 12LP, 14 nm, 14LPP, FinFET, GlobalFoundries, process technology

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

Read more
Desktop Processors Server Processors 

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

July 13, 2018May 25, 2021 David Schor Coffee Lake, Coffee Lake E, Intel, x86, Xeon E, Xeon E3

Intel has launched their fastest entry-level workstation microprocessors based on Coffee Lake.

Read more
Desktop Processors 

Intel Reveals Initial 9000-Series Coffee Lake SKUs

July 3, 2018May 25, 2021 David Schor 14 nm, Coffee Lake, Core i3, Core i5, x86

Intel has revealed the specs for some of the initial 9000-series Coffee Lake SKUs.

Read more
  • ← Previous
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Top Six Articles

  • IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology
  • Arm Launches The DSU-110 For New Armv9 CPU Clusters
  • Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
  • Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
  • TSMC Starts 5-Nanometer Risk Production
  • A Look At Intel 4 Process Technology

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

July 20, 2019May 25, 2021 David Schor
Samsung Foundry On EUV, Pellicles, Capacity, and Yield

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Arm Launches the Cortex-M55 and Its MicroNPU Companion, the Ethos-U55

Arm Launches the Cortex-M55 and Its MicroNPU Companion, the Ethos-U55

February 10, 2020May 25, 2021 David Schor
ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

January 3, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

November 11, 2018May 25, 2021 David Schor
Ayar Labs Realizes Co-Packaged Silicon Photonics

Ayar Labs Realizes Co-Packaged Silicon Photonics

January 19, 2020May 25, 2021 David Schor
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor
Apple’s iMac Pro Xeon W are ready

Apple’s iMac Pro Xeon W are ready

December 24, 2017May 25, 2021 David Schor
Samsung 17nm follows Intel 16

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor
IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

December 15, 2017May 25, 2021 David Schor
Intel Talks 10nm DTCO, EUV Benefits

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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